Armstrong offers new cooling solution
Armstrong Fluid Technology has recently launched Design Envelope EVERCOOL, an automation platform for rapid deployment in mission critical cooling applications.
The platform offers pre-engineered options that can be configured on-site. It meets the stringent requirements of the Uptime Institute for Tier III data centres, while avoiding the traditional requirements of extensive site programming and customization. The company says EVERCOOL reduces site commissioning time by up to 30% and reduces overall energy consumption, coordinating cooling system operation to reduce energy costs by up to 40%.
EVERCOOL uses a new design with internal redundancy and a hot-standby controller for continuous use. This design approach ensures seamless transfer (in less than 200 msec) between controllers in the event of a failure.
Peter Thomsen, director, Building Systems Solutions with Armstrong, said: "EVERCOOL is a great approach to accelerate project deployment and reduce project costs on any mission critical project, including Tier 1, 2, 3 or 4 data centres.”
